|| Z. Mu, and K. Willis, “SI and considerations for Gbps PCBs in communication systems,” IEEE Proc. Electrical Performance of Electronic Packaging, pp. 287-290, 2001. |
 R. Vahldieck, S. Chen, H. Jin, and P. Russer, “Flip-chip and bond wire/airbridge transitions between passive microwave transmission lines and laser diodes,” in 25th European Microwave Conf., Bologna, Italy, pp. 875-878, Sept. 1995.
 T. Krems, W. Haydl, H. Massler, and J. Rudiger, “Millimeter-wave performance of chip interconnections using wire bonding and flip chip,” in IEEE MTT-S int. Microwave Symp. Dig., vol. 1, San Francisco, pp. 247-250, CA, June 1996.
 G. Baumann, D. Ferling, and H. Richter, “Comparison of flip chip and wire bond interconnections and the technology evaluation on 51 GHz transceiver modules,” in 26th European Microwave Conf., vol. 1, Prague, Czech Republic, pp. 98-100, Sept. 1996.
 G. Strauss and W. menzel, “ A novel concept for MM-wave MMIC interconnects and packaging,” in IEEE MTT-S Int. Microwave Symp. Dig., San Diego, CA, pp. 1141-1144, May 1994.
 F. Alimenti, W. Menzel, P. Mezzanotte, L. roselli, and R. Sorrentino, “Analisi FDTD di connessioni ad accoppiamento elettromagnetico per circuiti integrati monolitici a onde millimetriche,” in XI Riunione Naz. Elettromag., Firenze, Italy, pp. 37-40, Oct. 1996.
 B. Young, Digital Signal Integrity-Modeling and Simulation with Interconnects and Package, Chap. 1, Prentice Hall PTR., 2000.
 S. H. Hall, G. W. Hall, and J. A. McCall, High-speed Digital System Design, John Wiley & Sons, Inc., 2000.
 H. W. Johnson and M. Graham, High-speed digital design, Prentice Hall PTR, Englewood Cliffs, New Jersey, 2002.
 I. Doerr, L. T. Hwang, G. Sommer, H. Oppermann, L. Li, M. Petras, S. Korf, F. Sahli, T. Myers, M. Miller, and W. John, “Parameterized Models for a RF Chip-To-Substrate Interconnect,” Electronic Components and Technology Conference., 2001. Proceedings., 51st , pp. 831-838, 29 May-1 June 2001.
 S. Nelson, M. Youngblood, J. Pavio, B. Larson, and R. Kottman, “Optimum microstrip interconnections,” IEEE International Microwave Symposium, vol. 3, Boston, pp. 1071-1074, Jun. 1991.
 F. Alimenti, P. Mezzanotte, L. Roselli, and R. Sorrentino, “Multi-wire microstrip interconnections: a systematic analysis for the extraction of an equivalent circuit,” in IEEE International Microwave Symposium, vol. 3, Baltimora, MD, Jun. 1998.
 W. menzel, “Packaging and interconnect techniques for complex millimeter-wave front-ends,” 28-th European Microwave Conference, vol. 1, Amsterdam, the Netherlands, pp. 497-502, Sep. 1998.
 F. Alimenti, U. Goebel, and R. Sorrentino, “Quasi Static Analysis of Microstrip Bondwire Interconnects,” Microwave Symposium Digest, 1995., IEEE MTT-S International , pp.679-682 vol.2, 16-20 May 1995.
 F. Alimenti, P. Mezzanotte, L. Roselli, and R. Sorrentino, “Modeling and characterization of the bonding-wire interconnection,” IEEE Trans. MTT , Vol.49 , No, 1 , pp. 142–150, Jan. 2001.
 U. Goebel, “DC to 100GHz chip-to-chip interconnects with reduced tolerance sensitivity by adaptive wirebonding,” in 3rd Topical Elect. Performance Electron. Packag. Meeting, Monterey, CA, Nov. 1994, pp. 182-185.
 N. G. Alexopoulos and S.-C. Wu, “Frequency-independent equivalent circuit model for microstrip open-end and gap discontinuities,” IEEE trans. Microwave Theory Tech., vol. 42, pp. 1268-1272, July 1994.
 H. Jin, R. Vahldieck, J. Huang, P. Russer, “Rigorous Analysis of Mixed Transmission Line Interconnects Using the Frequency-Domain TLM Method,” Microwave Theory and Techniques, IEEE Transactions on , Vol. 41, pp. 2248-2255, Dec. 1993.
 R. B. Wu, Time-Domain Simulation for transmission Lines, Research Project under Grant NSC-80-0404-E002-36, 1990.
 R. H. Caverly, “Characteristic Impedance of Integrated Circuit Bond Wires,” IEEE Trans. Microwave Theory Tech., vol. MTT-34, No.9, pp. 982-984, Sep. 1984.
 David M. Pozar, Microwave Engineering 2nd, Chap. 4, Wiley, 1998.
 M. D. Greenberg, Foundations of Applied mathematics, p291, Prentice-Hall,1978.
 Y. J. Yoon, B. Kim, “A New Formula for Effective Dielectric Constant in Multi-Dielectric Layer Microstrip Structure” Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
pp. 163 – 167 , Oct. 2000.
 H. Johnson, M. Graham, “High-Speed Signal Propagation” , Prentice Hall PTR., 2002, ch1.